TECC × THPCA × BOI

THPCA x BOI National PCB Collaboration & Merit Base Platform

Incentivizing Workforce Development, Technology Localization, and Prototype-to-Market Acceleration

How It Works

THPCA – Industry Orchestrator

Define demand and align BOI policy.

Industry Contribution

Industry & supply chain provide cash/equipment, engineers/trainers, products for pilot, and material. Universities provide students, researchers, and knowledge/IP.

TECC Platform

National PCB training, prototype & pilot production, and R&D.

BOI Merit Outcomes

Workforce development, technology localization, supply chain enhancement, and faster commercialization.

BOI Merit Examples for PCB Factories

People Development

Train 20-50 engineers per year
Upskill PCB manufacturing processes

Prototype & Pilot

5-10 prototypes per year
Commercial-scale pilot lots

Technology & R&D

3-5 R&D projects per year
Transfer know-how to local ecosystem

BOI Merit Outcomes

Eligible for merit-based incentives
Supports technology localization

Why PCB Factories Should Join TECC

Reduce Investment Risk

Test before full-scale investment with a shared pilot production line.

Develop Your Workforce

Job-ready engineers and a shorter learning curve.

Access BOI Merit Incentives

Workforce development, R&D, and technology localization.

Faster Time-to-Market

Prototype to pilot to commercialization, for stronger competitiveness.

BOI Merit-Based Incentive Areas

01 — R&D & Advanced Technology

02 — Human Resource Development

03 — Environmental & Sustainability

04 — Local Supplier Development

TECC enables BOI to convert industry collaboration into measurable merit outcomes: People, Technology, Prototype, Local Ecosystem, Market Readiness

Join TECC