Shop Floor & Training Facility

Hands-on PCB training on a real production line - from inner layer imaging to final inspection.

Our PCB Process

Print Inner Layer
Laser Direct Imaging - no photo-tool required
DES Develop-Etch-Strip
Develop photoresist, etch unwanted copper, strip resist
AOI Automatic Optical Inspection
Optical scan of circuit pattern to detect shorts, opens and defects
Laminate
Hydraulic heated press bonds inner layers into a multilayer stack
Drill
CNC drilling of vias and holes with high accuracy
Clean & Plate
Clean surface and apply a thin conductive copper layer
Outer Imaging LDI
Laser image outer circuit pattern with high-precision alignment
Pattern Plate
Electroplate copper to build up conductor thickness
Etch
Etch outer layer copper to reveal the final circuit pattern
Soldermask Coat
High-temperature protective coating over copper that is not soldered
Surface Finish
OSP / ENIG / Tin / Silver to protect copper and improve solderability
Silkscreen
Marking and legend printing
Electrical Test
Verify continuity, check isolation and shorts
Profile / Routing
CNC cut PCBs from the panel and create the final board outline
Final Inspection
Final visual and QA check to meet customer requirements